A new crop of magnetic switches, sensors, and PCB-based position encoders aims to redefine position sensing in automotive, industrial, and robotic designs.
A new crop of magnetic switches, sensors, and PCB-based position encoders aims to redefine position sensing in automotive, industrial, and robotic designs.
During a morning at Electronica's Hall A3, we visited numerous booths to learn about new instruments for an engineer's…
During a morning at Electronica's Hall A3, we visited numerous booths to learn about new instruments for an engineer's toolbox. Here are three highlights.
The new processor family offers a combination of real-time control and communications features.
The new processor family offers a combination of real-time control and communications features.
Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a…
Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a four-channel master IC and a dual-channel sensor signal conditioner IC.
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative…
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative user experience.
Power Integrations has upped its GaN game with InnoMux-2 IC, delivering more than 90% efficiency from a 1000 VDC bus and…
Power Integrations has upped its GaN game with InnoMux-2 IC, delivering more than 90% efficiency from a 1000 VDC bus and supplying up to 60 W from three accurately regulated outputs.
Unveiled today at Electronica, AMD designed the new FPGA to act as a “traffic cop” in larger AI systems.
Unveiled today at Electronica, AMD designed the new FPGA to act as a “traffic cop” in larger AI systems.
Announced today, the new solutions may improve testing and measurement for applications requiring greater power capacity…
Announced today, the new solutions may improve testing and measurement for applications requiring greater power capacity and efficiency.
Announced today, Onsemi calls the new platform the "industry’s most advanced" analog and mixed-signal platform, aiding…
Announced today, Onsemi calls the new platform the "industry’s most advanced" analog and mixed-signal platform, aiding the development of intelligent power management, sensor interfaces, and communications solutions.
Renesas' new 32-bit MCUs maintain the power of its RA8 series MCUs while streamlining their features, making them…
Renesas' new 32-bit MCUs maintain the power of its RA8 series MCUs while streamlining their features, making them cost-effective for high-volume embedded applications.
Announced today, the new transceiver will allow manufacturers to streamline communication between sensors, actuators, and…
Announced today, the new transceiver will allow manufacturers to streamline communication between sensors, actuators, and controllers.
Three new processor series may bring AI performance and reliability to the industrial sector.
Three new processor series may bring AI performance and reliability to the industrial sector.
The new models include 16 digital channels, four analog channels, and a broad feature set in a headless oscilloscope.
The new models include 16 digital channels, four analog channels, and a broad feature set in a headless oscilloscope.
One of the 20th century’s masters of the electron, Professor Jayant Baliga adds the 2024 Millennium Technology Prize to…
One of the 20th century’s masters of the electron, Professor Jayant Baliga adds the 2024 Millennium Technology Prize to his long list of honors and awards.
Bourns’ new products meet next-gen needs for signal transmission, high-current sensing, and surge protection.
Bourns’ new products meet next-gen needs for signal transmission, high-current sensing, and surge protection.
In this edition of Tech Shorts, we spotlight six snippets of industry news targeting power, connectivity, AI, and beyond.
In this edition of Tech Shorts, we spotlight six snippets of industry news targeting power, connectivity, AI, and beyond.
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices,…
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon.
Announced today, the new DAQ blends high-performance data capture with robust software support.
Announced today, the new DAQ blends high-performance data capture with robust software support.
The new high-current chokes use a novel alloy powder core material with superior saturation properties to push the…
The new high-current chokes use a novel alloy powder core material with superior saturation properties to push the boundaries of current density.
The M2003 series, with an Arm Cortex-M23 core, now offers 32-bit capabilities to improve system performance in a compact…
The M2003 series, with an Arm Cortex-M23 core, now offers 32-bit capabilities to improve system performance in a compact 20-pin package.
Facebook
Google
GitHub
Linkedin