The MT72xx family combines high EMC resilience and functional safety with a two-wire interface.
The MT72xx family combines high EMC resilience and functional safety with a two-wire interface.
Announced today, the new device challenges the assumption that Ethernet can't support small packet sizes or optimized…
Announced today, the new device challenges the assumption that Ethernet can't support small packet sizes or optimized transport paths.
Major players are reshaping the semiconductor map: TSMC exits GaN, Infineon scales it up, GlobalFoundries goes vertical…
Major players are reshaping the semiconductor map: TSMC exits GaN, Infineon scales it up, GlobalFoundries goes vertical with MIPS, and TI backs U.S. fabs with $60B.
As the AI industry hits an energy wall, Arago is rewriting the rules of compute.
As the AI industry hits an energy wall, Arago is rewriting the rules of compute.
The new oscilloscope series features high-speed signal capture and a 40 GSa/s sampling rate.
The new oscilloscope series features high-speed signal capture and a 40 GSa/s sampling rate.
Vishay, TDK, and Murata have debuted space-saving passives: ultra-high-frequency chip resistors, high-current inductors,…
Vishay, TDK, and Murata have debuted space-saving passives: ultra-high-frequency chip resistors, high-current inductors, and the "world’s smallest" 10 µF/50V MLCC for cars.
New releases from Siglent, Rohde & Schwarz, and Liquid Instruments bring new features to the T&M marketplace.
New releases from Siglent, Rohde & Schwarz, and Liquid Instruments bring new features to the T&M marketplace.
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other…
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other automotive systems.
The new power-management IC integrates advanced system management and ultra-low power fuel gauging in a single chip.
The new power-management IC integrates advanced system management and ultra-low power fuel gauging in a single chip.
Siemens, Nordic Semiconductor, and SkyWater Technology have each completed strategic acquisitions across software, cloud,…
Siemens, Nordic Semiconductor, and SkyWater Technology have each completed strategic acquisitions across software, cloud, and foundry capacity.
Pico has released a new series of PC-based, high-bandwidth sampling oscilloscopes with direct-input triggering and…
Pico has released a new series of PC-based, high-bandwidth sampling oscilloscopes with direct-input triggering and pre-trigger capture capabilities.
Ever wonder where the Schottky diode got its name?
Ever wonder where the Schottky diode got its name?
Micron claims the new SSD one-ups TLC value drives in user experience while maintaining QLC economics.
Micron claims the new SSD one-ups TLC value drives in user experience while maintaining QLC economics.
The new series is the first of the STM32 MCUs to use near-threshold voltage technology, bringing power efficiency and…
The new series is the first of the STM32 MCUs to use near-threshold voltage technology, bringing power efficiency and advanced security to cost-sensitive designs.
Renesas claims the new MCUs are the highest-performing Cortex-M devices on the market to date.
Renesas claims the new MCUs are the highest-performing Cortex-M devices on the market to date.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and…
As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and cost-effective electronic components continues to rise.
From spin-polarized graphene to vacuum-engineered insulators, three research breakthroughs push quantum materials closer…
From spin-polarized graphene to vacuum-engineered insulators, three research breakthroughs push quantum materials closer to practical, scalable technologies.
The upgraded multi-die IP solution may speed the SoC design process in an AI-driven market that demands greater chip performance.
The upgraded multi-die IP solution may speed the SoC design process in an AI-driven market that demands greater chip performance.
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center,…
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center, networking, and communications timing system.
Facebook
Google
GitHub
Linkedin