It’s Day Two of our weeklong virtual conference, and it begins with a keynote discussion with the fascinating Dr. Alex Lidow from EPC and continues with live…
It’s Day Two of our weeklong virtual conference, and it begins with a keynote discussion with the fascinating Dr. Alex Lidow from EPC and continues with live sessions from many other industry-leading companies.
The new MCU features a unique multicore architecture to optimize performance and power efficiency.
The new MCU features a unique multicore architecture to optimize performance and power efficiency.
The first day of Industry Tech Days 2024 begins with a keynote discussion with an expert from MIT about the challenges…
The first day of Industry Tech Days 2024 begins with a keynote discussion with an expert from MIT about the challenges facing societal institutions to keep up with the rapid growth in AI. Join us throughout the day for great live sessions with Q&A.
Welcome to Industry Tech Days 2024! This guide will help you navigate through the major features of the show and plan…
Welcome to Industry Tech Days 2024! This guide will help you navigate through the major features of the show and plan your participation.
ST designed its newest STPower silicon carbide (SiC) MOSFETs to improve efficiency, power density, and robustness for EV…
ST designed its newest STPower silicon carbide (SiC) MOSFETs to improve efficiency, power density, and robustness for EV powertrains and charging circuits.
The new chip measures currents, voltages, and temperatures in EV and hybrid-EV battery packs.
The new chip measures currents, voltages, and temperatures in EV and hybrid-EV battery packs.
The Agilex 3 line includes small form-factor FPGAs with AI and an integrated MCU.
The Agilex 3 line includes small form-factor FPGAs with AI and an integrated MCU.
AMD says the new Artix Ultrascale field programmable gate arrays maintain advanced capabilities while shrinking component…
AMD says the new Artix Ultrascale field programmable gate arrays maintain advanced capabilities while shrinking component size and cost.
The new sensor leverages photoacoustic spectroscopy to precisely detect carbon dioxide levels in a compact package.
The new sensor leverages photoacoustic spectroscopy to precisely detect carbon dioxide levels in a compact package.
Onsemi’s upgraded silicon and silicon carbide F5BP Power Modules offer more power density and efficiency.
Onsemi’s upgraded silicon and silicon carbide F5BP Power Modules offer more power density and efficiency.
While sound waves usually travel in two directions, researchers at ETH Zurich have discovered how to guide—and…
While sound waves usually travel in two directions, researchers at ETH Zurich have discovered how to guide—and amplify—sound waves in one direction without losing energy.
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices,…
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon.
The quality of our All About Circuits content comes from understanding our audience (that's you!) and your interests.…
The quality of our All About Circuits content comes from understanding our audience (that's you!) and your interests. Please complete this survey to update us on the electronics industry, and you might just win one of several Amazon card prizes!
Announced today, the new DAQ blends high-performance data capture with robust software support.
Announced today, the new DAQ blends high-performance data capture with robust software support.
The new sensors leverage tunnel magnetoresistance sensing to sharpen sensitivity and precision.
The new sensors leverage tunnel magnetoresistance sensing to sharpen sensitivity and precision.
Dr. Goodenough received a Nobel Prize at the age of 97 for his contributions to making the Lithium-ion battery a reality.
Dr. Goodenough received a Nobel Prize at the age of 97 for his contributions to making the Lithium-ion battery a reality.
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current…
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current storage infrastructure.
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by…
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.
The new high-current chokes use a novel alloy powder core material with superior saturation properties to push the…
The new high-current chokes use a novel alloy powder core material with superior saturation properties to push the boundaries of current density.
The 14-bit scope combines architectural improvements and software support for higher resolution, real-time processing,…
The 14-bit scope combines architectural improvements and software support for higher resolution, real-time processing, and enhanced signal analysis.
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