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Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.


News Mar 11, 2026 by Joshua Tidwell
Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.


News Mar 10, 2026 by Jake Hertz
Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.


News Mar 09, 2026 by Duane Benson
Menlo Micro Announces Configurable Switch for Semiconductor Testing

Menlo Micro Announces Configurable Switch for Semiconductor Testing

The company claims the MEMS switch is in a league of its own, replacing mechanical and solid-state relays in high-speed semiconductor test equipment.


News Mar 03, 2026 by Duane Benson
SK Hynix Details Low-Power DDR6 SDRAM at ISSCC 2026

SK Hynix Details Low-Power DDR6 SDRAM at ISSCC 2026

SK Hynix's new LPDDR6 SDRAM exhibits five key innovations to improve performance, reduce power consumption, and increase reliability.


News Feb 26, 2026 by Duane Benson
ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.


News Feb 25, 2026 by Luke James
New Materials Target Interconnect Performance and On-Chip Photonics

New Materials Target Interconnect Performance and On-Chip Photonics

New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.


News Feb 24, 2026 by Luke James
TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software into larger platforms spanning IoT, automotive, industrial, and semiconductor manufacturing.


News Feb 17, 2026 by Luke James
STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

The new MCU includes a dedicated neural processor and phase-change memory to boost performance in X-in-1 architectures.


News Feb 17, 2026 by Jake Hertz
Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Researchers are advancing materials and device concepts that treat heat as something that can be stored, directed, or actively managed, rather than merely dissipated.


News Feb 11, 2026 by Luke James
Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.


News Feb 10, 2026 by Duane Benson
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.


News Feb 05, 2026 by Duane Benson
IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.


News Feb 04, 2026 by Luke James
AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.


News Feb 04, 2026 by Jake Hertz
Raspberry Pi Introduces Its First HAT Product for Generative AI

Raspberry Pi Introduces Its First HAT Product for Generative AI

Raspberry Pi's new AI HAT+ 2 adds higher-performance neural acceleration and memory support to extend generative workloads on Raspberry Pi 5.


News Feb 03, 2026 by Jake Hertz
Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev

Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev

The new toolkit integrates with Keysight’s device modeling software to automate parameter extraction and shorten compact-model and PDK development cycles.


News Jan 30, 2026 by Luke James
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.


News Jan 27, 2026 by Austin Futrell
Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.


News Jan 22, 2026 by Joshua Tidwell