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EU’s European Investment Bank Meets the Unique Needs of Semiconductors

EU’s European Investment Bank Meets the Unique Needs of Semiconductors

Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.


News Apr 07, 2026 by Gordon Feller
Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi is combining cell-level data tracking with a wireless communication architecture to address traceability requirements and reduce wiring complexity in battery systems.


News Apr 06, 2026 by Shannon Cuthrell
Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

The startup's programmable chip uses a metasurface architecture to control light without moving parts.


News Apr 01, 2026 by Luke James
Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. says the device balances the demands of advanced headlight control units, including power density, efficiency, EMI, and functional safety.


News Mar 30, 2026 by Austin Futrell
Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.


News Mar 30, 2026 by Duane Benson
4 Standout Microcontrollers From Embedded World 2026

4 Standout Microcontrollers From Embedded World 2026

These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.


News Mar 23, 2026 by Duane Benson
At Embedded World, Renesas 365 Advances to General Availability Phase

At Embedded World, Renesas 365 Advances to General Availability Phase

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.


News Mar 20, 2026 by Duane Benson
Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.


News Mar 11, 2026 by Joshua Tidwell
NXP Drives Zonal Computing Transition With New Reference System

NXP Drives Zonal Computing Transition With New Reference System

Announced today, the new zonal reference system includes pre-validated hardware and software for automotive intelligent data handling and multi-volt power distribution.


News Mar 10, 2026 by Duane Benson
ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage switching applications in EVs and hybrid vehicles.


News Mar 06, 2026 by Austin Futrell
NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

The automotive- and industrial-grade devices target low-cost multidrop Ethernet with CAN-like simplicity.


News Mar 03, 2026 by Jake Hertz
New Automotive ICs Cover Signal Integrity, Power Density, & Integration

New Automotive ICs Cover Signal Integrity, Power Density, & Integration

Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.


News Mar 02, 2026 by Austin Futrell
Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

With increasing electrification across vehicle subsystems, Toshiba is rolling out brushed and brushless DC motor control components.


News Feb 26, 2026 by Charles Lee
Renesas Looks to the Future of Automotive With New Memory and SoC Tech

Renesas Looks to the Future of Automotive With New Memory and SoC Tech

The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.


News Feb 24, 2026 by Jake Hertz
Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.


News Feb 23, 2026 by Luke James
STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

The new MCU includes a dedicated neural processor and phase-change memory to boost performance in X-in-1 architectures.


News Feb 17, 2026 by Jake Hertz
Microchip Adds 12 Devices in 600 V Gate Driver Family

Microchip Adds 12 Devices in 600 V Gate Driver Family

The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.


News Feb 12, 2026 by Joshua Tidwell
Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.


News Feb 02, 2026 by Jake Hertz
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell