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Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

The new ADAA245x series increases bandwidth by 400 percent and introduces Ethernet tunneling for software-defined vehicles.


News May 01, 2026 by Jake Hertz
Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

The CAN FD-capable part targets battery management systems and high-voltage industrial buses, integrating signal isolation with bus protection in a single package.


News Apr 29, 2026 by Luke James
Higher Volts, Smaller Caps: New MLCCs for Auto, Aero, and Defense

Higher Volts, Smaller Caps: New MLCCs for Auto, Aero, and Defense

Discover how the latest MLCCs from Samsung, Murata, and Kyocera are tackling extreme environments through unprecedented power density and miniaturization.


News Apr 28, 2026 by Duane Benson
Microchip’s CLB MCUs Marry Programmable Logic and Embedded Control

Microchip’s CLB MCUs Marry Programmable Logic and Embedded Control

The configurable logic block microcontrollers grant developers the flexibility of an MCU-based design with the deterministic capability of dedicated hardware.


News Apr 28, 2026 by Duane Benson
EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

We spoke to Nuvoton’s Walter Tseng in this exclusive Embedded World 2026 interview. Our focus was all things microcontrollers, ranging from low power to Edge AI to automotive MCUs.


News Apr 13, 2026 by Jeff Child
Rohm Shoots Out 17 New Op Amps to Its High-Performance Portfolio

Rohm Shoots Out 17 New Op Amps to Its High-Performance Portfolio

The new CMOS op amps combine low offset voltage, low noise, and 10-V/μs slew rate for flexible precision design.


News Apr 09, 2026 by Joshua Tidwell
EU’s European Investment Bank Meets the Unique Needs of Semiconductors

EU’s European Investment Bank Meets the Unique Needs of Semiconductors

Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.


News Apr 07, 2026 by Gordon Feller
Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi is combining cell-level data tracking with a wireless communication architecture to address traceability requirements and reduce wiring complexity in battery systems.


News Apr 06, 2026 by Shannon Cuthrell
Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

The startup's programmable chip uses a metasurface architecture to control light without moving parts.


News Apr 01, 2026 by Luke James
Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. says the device balances the demands of advanced headlight control units, including power density, efficiency, EMI, and functional safety.


News Mar 30, 2026 by Austin Futrell
Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.


News Mar 30, 2026 by Duane Benson
4 Standout Microcontrollers From Embedded World 2026

4 Standout Microcontrollers From Embedded World 2026

These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.


News Mar 23, 2026 by Duane Benson
At Embedded World, Renesas 365 Advances to General Availability Phase

At Embedded World, Renesas 365 Advances to General Availability Phase

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.


News Mar 20, 2026 by Duane Benson
Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.


News Mar 11, 2026 by Joshua Tidwell
NXP Drives Zonal Computing Transition With New Reference System

NXP Drives Zonal Computing Transition With New Reference System

Announced today, the new zonal reference system includes pre-validated hardware and software for automotive intelligent data handling and multi-volt power distribution.


News Mar 10, 2026 by Duane Benson
ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage switching applications in EVs and hybrid vehicles.


News Mar 06, 2026 by Austin Futrell
NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

The automotive- and industrial-grade devices target low-cost multidrop Ethernet with CAN-like simplicity.


News Mar 03, 2026 by Jake Hertz
New Automotive ICs Cover Signal Integrity, Power Density, & Integration

New Automotive ICs Cover Signal Integrity, Power Density, & Integration

Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.


News Mar 02, 2026 by Austin Futrell
Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

With increasing electrification across vehicle subsystems, Toshiba is rolling out brushed and brushless DC motor control components.


News Feb 26, 2026 by Charles Lee
Renesas Looks to the Future of Automotive With New Memory and SoC Tech

Renesas Looks to the Future of Automotive With New Memory and SoC Tech

The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.


News Feb 24, 2026 by Jake Hertz