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ST Makes Its Foray Into Silicon Photonic ICs for Data Center Interconnects

ST Makes Its Foray Into Silicon Photonic ICs for Data Center Interconnects

With Amazon Web Services as a major partner, STMicroelectronics has launched its first silicon photonics solution.


News Feb 21, 2025 by Jake Hertz
Can GaN Solve AI Data Center Power Needs in 2025?

Can GaN Solve AI Data Center Power Needs in 2025?

Gallium nitride’s market is expected to expand in AI data centers, electric vehicles, and other high-power needs


News Feb 18, 2025 by Jake Hertz
The Powers and Players Driving the Next Gen of HPC

The Powers and Players Driving the Next Gen of HPC

As the high-performance computing (HPC) market swells, semiconductor leaders are honing in on GPU speeds and advanced thermal management.


News Feb 14, 2025 by Seth Price
Synopsys Introduces HAV Systems Supporting 60 Billion Gate Designs

Synopsys Introduces HAV Systems Supporting 60 Billion Gate Designs

Released today, Synopsys built its solutions on the AMD Versal Premium VP1902 SoC to push the state of hardware-assisted verification (HAV).


News Feb 13, 2025 by Jake Hertz
Congatec’s Modular IoT Platform Secures Connectivity ‘From COM to Cloud’

Congatec’s Modular IoT Platform Secures Connectivity ‘From COM to Cloud’

Based on four preconfigured software building blocks, Congatec's aReady.IOT streamlines and secures data transfer between different systems and devices.


News Feb 11, 2025 by Joshua Tidwell
Business Shorts: Partnerships Advancing 5G, ASIC Design, and More

Business Shorts: Partnerships Advancing 5G, ASIC Design, and More

In this edition of Business Shorts, Altium acquires Part Analytics, Keysight opens a 6G research lab, and Siemens throws its support behind budding startups.


News Feb 10, 2025 by Luke James
Keysight Preps for LPDDR6 With Memory Design and Test Options

Keysight Preps for LPDDR6 With Memory Design and Test Options

Keysight's new solution tackles LPDDR6 workflows for end-to-end memory design and testing.


News Feb 04, 2025 by Duane Benson
January Tech Shorts: Stacked Analog ICs, SPAD Image Sensors, and More

January Tech Shorts: Stacked Analog ICs, SPAD Image Sensors, and More

In this Tech Shorts, we highlight six products, certifications, and collaborations, setting a fast pace for innovation in 2025.


News Jan 31, 2025 by Luke James
NXP Launches Tiny Secure Authenticator IC Based on RISC-V

NXP Launches Tiny Secure Authenticator IC Based on RISC-V

With a RISC-V core and cryptographic support, the EdgeLock A30 provides security in a small package.


News Jan 29, 2025 by Aaron Carman
One Month Into 2025, Business Deals Fire Up the Semiconductor Industry

One Month Into 2025, Business Deals Fire Up the Semiconductor Industry

From Cadence taking over Secure-IC to Quantum Brilliance pocketing $20 million in funding, the semiconductor is already making big moves this year.


News Jan 28, 2025 by Luke James
Chiplet Summit 2025 Nods to a Bright Future for Disaggregated Computing

Chiplet Summit 2025 Nods to a Bright Future for Disaggregated Computing

New solutions from big names like Arm and Keysight and up-and-comers like Numem were telling highlights from this year’s conference.


News Jan 23, 2025 by Jake Hertz
CES Exclusive: Why SiTime Believes Silicon Is the Future of Timing

CES Exclusive: Why SiTime Believes Silicon Is the Future of Timing

In an exclusive interview with the SiTime team, we discussed the benefits of MEMS-based timing solutions over their quartz-oscillator counterparts.


News Jan 21, 2025 by Jake Hertz
Renesas Serves Up 100 V MOSFETs Using Split Gate Technology

Renesas Serves Up 100 V MOSFETs Using Split Gate Technology

Thanks to a new process, the two power FETs feature incredibly low on-resistance and high switching efficiency.


News Jan 17, 2025 by Aaron Carman
Easing Data Center Burdens, SiTime Launches Differential-Ended Oscillator

Easing Data Center Burdens, SiTime Launches Differential-Ended Oscillator

The new differential-ended oscillator is the company’s first specifically designed to optimize efficiency in AI data centers.


News Jan 16, 2025 by Jake Hertz
IBM Introduces Co-Packaged Optics, an Optical Link Packaging Scheme

IBM Introduces Co-Packaged Optics, an Optical Link Packaging Scheme

IBM believes its new research may increase the efficiency and density of generative AI computing.


News Jan 14, 2025 by Jake Hertz
Industry Weighs in With 2025 Forecasts—Part 1: General Predictions

Industry Weighs in With 2025 Forecasts—Part 1: General Predictions

On this New Years Day, we share 2025 predictions from leading companies in our industry.


News Jan 01, 2025 by Jeff Child
Everything Goes Up! Top Trends of 2024

Everything Goes Up! Top Trends of 2024

Three hot technologies are leading the way in continuing the Moore’s Law performance increases that can no longer be achieved by transistor scaling alone.


News Dec 23, 2024 by Dale Wilson
Our 2024 Favorites: Hand-Picked Highlights from the All About Circuits Team

Our 2024 Favorites: Hand-Picked Highlights from the All About Circuits Team

We publish hundreds of articles every year—too many even for our team to read them all. So, we decided to share our favorite 2024 news, technical articles, projects, and podcasts with each other and all of you. Enjoy!


News Dec 20, 2024 by Dale Wilson
Broadcom Reaches New Processing Heights With Stacked Die and Face-to-Face Chiplets

Broadcom Reaches New Processing Heights With Stacked Die and Face-to-Face Chiplets

The new configuration increases computing core area within the same overall processor package dimensions.


News Dec 09, 2024 by Duane Benson
SemiQon Develops First CMOS Transistor to Operate at Cryogenic Temps

SemiQon Develops First CMOS Transistor to Operate at Cryogenic Temps

The quantum hardware company claims its cryo-CMOS transistor solves two critical roadblocks to quantum computing: scaling and cooling costs.


News Dec 05, 2024 by Luke James