New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and…
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and cross-correlation.
Scientists boosted lithium-carbon dioxide batteries’ performance and life cycle, showing promise for use on Mars and Earth.
Scientists boosted lithium-carbon dioxide batteries’ performance and life cycle, showing promise for use on Mars and Earth.
Astrobotic and WiBotic have qualified the first wireless charging system for lunar missions, enabling dust-resistant,…
Astrobotic and WiBotic have qualified the first wireless charging system for lunar missions, enabling dust-resistant, connector-free power transfer on the moon.
Fabricated at Infineon’s own foundry, the GaN transistors are the first to earn the highest certification of…
Fabricated at Infineon’s own foundry, the GaN transistors are the first to earn the highest certification of reliability by the U.S. Defense Logistics Agency.
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome…
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome the limits of analog alternatives.
The latest devices from Microchip, Rohm, and SemiQ offer enhanced radiation protection, increased operation range, lower…
The latest devices from Microchip, Rohm, and SemiQ offer enhanced radiation protection, increased operation range, lower conduction losses, and faster switching frequencies.
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard…
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Zero ASIC says its approach standardizes an eFPGA architecture in the same way that RISC-V did for CPUs and JEDEC did for memory.
Zero ASIC says its approach standardizes an eFPGA architecture in the same way that RISC-V did for CPUs and JEDEC did for memory.
In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive…
In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive SoCs, embedded x86, and the outlook ahead.
With options ranging from 22 V to 200 V, the radiation-hardened gate drivers can bolster power system efficiency for any…
With options ranging from 22 V to 200 V, the radiation-hardened gate drivers can bolster power system efficiency for any space mission.
The new ThermaView suite supports hybridized focal plane arrays (FPAs) and monolithically fabricated microbolometer FPAs…
The new ThermaView suite supports hybridized focal plane arrays (FPAs) and monolithically fabricated microbolometer FPAs for uncooled imaging.
In this edition of Business Shorts, Altium acquires Part Analytics, Keysight opens a 6G research lab, and Siemens throws…
In this edition of Business Shorts, Altium acquires Part Analytics, Keysight opens a 6G research lab, and Siemens throws its support behind budding startups.
From tunable metamaterials inspired by chameleons to radiation-resistant organic solar cells, these discoveries address…
From tunable metamaterials inspired by chameleons to radiation-resistant organic solar cells, these discoveries address critical challenges in fields like defense, space exploration, communication, and manufacturing.
The new solution merges the benefits of a crystal oscillator and an atomic clock into one uniform package.
The new solution merges the benefits of a crystal oscillator and an atomic clock into one uniform package.
Announced today, the new series integrates RF-sampling converters and high-performance compute on a single chip.
Announced today, the new series integrates RF-sampling converters and high-performance compute on a single chip.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
During a morning at Electronica's Hall A3, we visited numerous booths to learn about new instruments for an engineer's…
During a morning at Electronica's Hall A3, we visited numerous booths to learn about new instruments for an engineer's toolbox. Here are three highlights.
Announced at Electronica last week, the TDC solution offers higher integration and improved performance for single-beam LiDAR.
Announced at Electronica last week, the TDC solution offers higher integration and improved performance for single-beam LiDAR.
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