The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Zero ASIC says its approach standardizes an eFPGA architecture in the same way that RISC-V did for CPUs and JEDEC did for memory.
Zero ASIC says its approach standardizes an eFPGA architecture in the same way that RISC-V did for CPUs and JEDEC did for memory.
In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive…
In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive SoCs, embedded x86, and the outlook ahead.
With options ranging from 22 V to 200 V, the radiation-hardened gate drivers can bolster power system efficiency for any…
With options ranging from 22 V to 200 V, the radiation-hardened gate drivers can bolster power system efficiency for any space mission.
The new ThermaView suite supports hybridized focal plane arrays (FPAs) and monolithically fabricated microbolometer FPAs…
The new ThermaView suite supports hybridized focal plane arrays (FPAs) and monolithically fabricated microbolometer FPAs for uncooled imaging.
In this edition of Business Shorts, Altium acquires Part Analytics, Keysight opens a 6G research lab, and Siemens throws…
In this edition of Business Shorts, Altium acquires Part Analytics, Keysight opens a 6G research lab, and Siemens throws its support behind budding startups.
From tunable metamaterials inspired by chameleons to radiation-resistant organic solar cells, these discoveries address…
From tunable metamaterials inspired by chameleons to radiation-resistant organic solar cells, these discoveries address critical challenges in fields like defense, space exploration, communication, and manufacturing.
The new solution merges the benefits of a crystal oscillator and an atomic clock into one uniform package.
The new solution merges the benefits of a crystal oscillator and an atomic clock into one uniform package.
Announced today, the new series integrates RF-sampling converters and high-performance compute on a single chip.
Announced today, the new series integrates RF-sampling converters and high-performance compute on a single chip.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
Infineon says the new solution is an industry first for radiation-hardened NOR Flash.
During a morning at Electronica's Hall A3, we visited numerous booths to learn about new instruments for an engineer's…
During a morning at Electronica's Hall A3, we visited numerous booths to learn about new instruments for an engineer's toolbox. Here are three highlights.
Announced at Electronica last week, the TDC solution offers higher integration and improved performance for single-beam LiDAR.
Announced at Electronica last week, the TDC solution offers higher integration and improved performance for single-beam LiDAR.
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative…
The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative user experience.
Microchip tapped SiFive's RISC-V CPUs for its new mission-critical processors.
Microchip tapped SiFive's RISC-V CPUs for its new mission-critical processors.
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices,…
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon.
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current…
New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current storage infrastructure.
Menlo Micro will develop a 1 kV/10 kA circuit breaker with enhanced performance for Navy electrical distribution systems.
Menlo Micro will develop a 1 kV/10 kA circuit breaker with enhanced performance for Navy electrical distribution systems.
This week, memory makers big and small have rolled out NAND Flash, MRAM, and DDR innovations ahead of the rebranded…
This week, memory makers big and small have rolled out NAND Flash, MRAM, and DDR innovations ahead of the rebranded Future of Memory Storage show.
Using a non-contact thermometer with a near-infrared (NIR) spectrometer, the team eliminated the need for precise…
Using a non-contact thermometer with a near-infrared (NIR) spectrometer, the team eliminated the need for precise emissivity values.
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