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NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio

NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio

NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.


News Mar 17, 2026 by Jake Hertz
Ventuno Q: The First Fruit of the Arduino-Qualcomm Acquisition Targets AI

Ventuno Q: The First Fruit of the Arduino-Qualcomm Acquisition Targets AI

Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.


News Mar 16, 2026 by Duane Benson
MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.


News Mar 16, 2026 by Luke James
Understanding the Exclusive-OR Phase Detector

Understanding the Exclusive-OR Phase Detector

This article explores the operation of the simplest digital phase detector: the exclusive-OR (XOR) gate.


Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.


News Mar 12, 2026 by Jake Hertz
Build Your Own Clock With Analog Dials, Part 3

Build Your Own Clock With Analog Dials, Part 3

To complete this project, we add backlight control and temperature-sensing functionality to the clock we built in the previous installments.


Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.


News Mar 09, 2026 by Duane Benson
Build Your Own Clock With Analog Dials, Part 2

Build Your Own Clock With Analog Dials, Part 2

We continue our design of a clock that uses analog ammeters to display time and temperature. In this installment, we examine the second of the two circuits that enable the timekeeping function.


New Automotive ICs Cover Signal Integrity, Power Density, & Integration

New Automotive ICs Cover Signal Integrity, Power Density, & Integration

Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.


News Mar 02, 2026 by Austin Futrell
Using Gilbert Multipliers as Phase Detectors in PLLs

Using Gilbert Multipliers as Phase Detectors in PLLs

This article explores the operation of the Gilbert-cell phase detector for both small and large signals.


Inside the 7400-Series Era of Digital Logic

Inside the 7400-Series Era of Digital Logic

Texas Instruments’ SN7400 and the broader 7400-series TTL family defined how digital systems were built, debugged, and scaled from the mid-1960s through the early microprocessor age.


News Feb 27, 2026 by Luke James
Build Your Own Clock With Analog Dials, Part 1

Build Your Own Clock With Analog Dials, Part 1

This project turns old-school analog ammeters into a working clock that can also display the ambient temperature.


ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.


News Feb 25, 2026 by Luke James
New Materials Target Interconnect Performance and On-Chip Photonics

New Materials Target Interconnect Performance and On-Chip Photonics

New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.


News Feb 24, 2026 by Luke James
Three Ways to Accelerate Cell Layout in DTCO

Three Ways to Accelerate Cell Layout in DTCO

The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this time-consuming process using automation.


Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Learn how scaling beyond Dennard's limits triggered short-channel effects (SCE) and why transitioning from FinFET to Gate-All-Around (GAA) architectures is vital for 2 nm control.


TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software into larger platforms spanning IoT, automotive, industrial, and semiconductor manufacturing.


News Feb 17, 2026 by Luke James
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.


News Feb 05, 2026 by Duane Benson
IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.


News Feb 04, 2026 by Luke James