Siemens, Nordic Semiconductor, and SkyWater Technology have each completed strategic acquisitions across software, cloud, and foundry capacity.
Siemens, Nordic Semiconductor, and SkyWater Technology have each completed strategic acquisitions across software, cloud, and foundry capacity.
From spin-polarized graphene to vacuum-engineered insulators, three research breakthroughs push quantum materials closer…
From spin-polarized graphene to vacuum-engineered insulators, three research breakthroughs push quantum materials closer to practical, scalable technologies.
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center,…
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center, networking, and communications timing system.
An autonomous infrastructure platform built on AI agents is reshaping how enterprises manage cloud environments.
An autonomous infrastructure platform built on AI agents is reshaping how enterprises manage cloud environments.
The company aims to realize a 200-logical-qubit system by 2029.
The company aims to realize a 200-logical-qubit system by 2029.
Following Arm's announcement of its new AI-defined automotive platform, several key EDA players have upgraded their…
Following Arm's announcement of its new AI-defined automotive platform, several key EDA players have upgraded their toolsets with support.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
The new updates leverage AI to develop reliable circuits without all the tedious work, while also keeping high-speed…
The new updates leverage AI to develop reliable circuits without all the tedious work, while also keeping high-speed routing tight and efficient.
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome…
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome the limits of analog alternatives.
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
New software editions bring enterprise-grade functionality to small- and medium-sized teams.
New software editions bring enterprise-grade functionality to small- and medium-sized teams.
The new processor reportedly offers 100x lower latency and 500x lower energy consumption than conventional AI processors.
The new processor reportedly offers 100x lower latency and 500x lower energy consumption than conventional AI processors.
At Computex 2025, Intel expanded its hardware lineup with GPUs for AI inference and creative workloads and an accelerator…
At Computex 2025, Intel expanded its hardware lineup with GPUs for AI inference and creative workloads and an accelerator for large-scale generative AI training.
Intel and Shell have partnered to deliver the first Intel-certified immersion cooling solution for Xeon processors,…
Intel and Shell have partnered to deliver the first Intel-certified immersion cooling solution for Xeon processors, addressing rising AI data center demands.
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and…
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate…
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to…
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to provide comprehensive support for the AI boom.
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved…
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.
Siemens, Nokia, Infineon, Onsemi, and Black Semiconductor are making targeted acquisitions to expand their capabilities…
Siemens, Nokia, Infineon, Onsemi, and Black Semiconductor are making targeted acquisitions to expand their capabilities in manufacturing, connectivity, and advanced materials.
New photonic devices are testing the bounds of optical technology, from creating direct quantum links to achieving…
New photonic devices are testing the bounds of optical technology, from creating direct quantum links to achieving one-way light control.
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