The new timing solutions bring precise synchronization to harsh or signal-denied environments.
The new timing solutions bring precise synchronization to harsh or signal-denied environments.
In this roundup, we spotlight small, medium, and large antenna announcements fortifying communication across industries,…
In this roundup, we spotlight small, medium, and large antenna announcements fortifying communication across industries, from drones to satellites.
Vannevar Bush shaped how the United States builds, funds, and thinks about technology. As both inventor and institutional…
Vannevar Bush shaped how the United States builds, funds, and thinks about technology. As both inventor and institutional architect, his work laid the foundations for digital logic, wartime research coordination, and the entire modern R&D landscape.
Behind the foundational and advanced radar textbooks of our day stood the brilliant engineer and researcher Merrill Skolnik.
Behind the foundational and advanced radar textbooks of our day stood the brilliant engineer and researcher Merrill Skolnik.
The company claims the new 16-GB DDR4 model is the highest density space-grade DDR4 memory on the market.
The company claims the new 16-GB DDR4 model is the highest density space-grade DDR4 memory on the market.
Micron’s 256-Gb radiation-tolerant SLC NAND meets tight aerospace reliability benchmarks.
Micron’s 256-Gb radiation-tolerant SLC NAND meets tight aerospace reliability benchmarks.
The new demonstrator offers a complete hardware development solution with a GaN power stage for three-phase,…
The new demonstrator offers a complete hardware development solution with a GaN power stage for three-phase, radiation-exposed motor drive systems.
Pico has released a new series of PC-based, high-bandwidth sampling oscilloscopes with direct-input triggering and…
Pico has released a new series of PC-based, high-bandwidth sampling oscilloscopes with direct-input triggering and pre-trigger capture capabilities.
As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and…
As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and cost-effective electronic components continues to rise.
New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and…
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and cross-correlation.
Scientists boosted lithium-carbon dioxide batteries’ performance and life cycle, showing promise for use on Mars and Earth.
Scientists boosted lithium-carbon dioxide batteries’ performance and life cycle, showing promise for use on Mars and Earth.
Astrobotic and WiBotic have qualified the first wireless charging system for lunar missions, enabling dust-resistant,…
Astrobotic and WiBotic have qualified the first wireless charging system for lunar missions, enabling dust-resistant, connector-free power transfer on the moon.
Fabricated at Infineon’s own foundry, the GaN transistors are the first to earn the highest certification of…
Fabricated at Infineon’s own foundry, the GaN transistors are the first to earn the highest certification of reliability by the U.S. Defense Logistics Agency.
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome…
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome the limits of analog alternatives.
The latest devices from Microchip, Rohm, and SemiQ offer enhanced radiation protection, increased operation range, lower…
The latest devices from Microchip, Rohm, and SemiQ offer enhanced radiation protection, increased operation range, lower conduction losses, and faster switching frequencies.
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard…
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Zero ASIC says its approach standardizes an eFPGA architecture in the same way that RISC-V did for CPUs and JEDEC did for memory.
Zero ASIC says its approach standardizes an eFPGA architecture in the same way that RISC-V did for CPUs and JEDEC did for memory.
In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive…
In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive SoCs, embedded x86, and the outlook ahead.
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